Session and scheduling information are listed below. Select a session from the list and press "Go" to view the abstracts for that session.
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Session
91
: MicroLED Transfer and Repair |
Emissive, Micro-LED, and Quantum-Dot Displays
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Friday, May 17 / 10:40 AM - 12:20 PM / San Jose Convention Center, 220C
Chair:
Jean-Jacques Drolet, Osram Opto Semiconductors, Regensburg, Germany
Co-Chair:
Khaled Ahmed, Intel Corporation, Santa Clara, CA US
91.1 - Invited Paper: MicroLED Stamp Transfer and Repair Technology for Tiling Display (10:40 AM - 11:00 AM)
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Yan Wang, Yongxin Cui, Jiye Xia, Xuan Cao
Chengdu Vistar Optoelectronics Co., Ltd Chengdu China
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Stamp transfer is the closest mass-transfer technology toward the possibility of mass production of microLEDs. Along with more mature inspection and repair, slicing, driving and demura technology, Vistar has developed a full-process solution for the fabrication of a 102-in. large-area splicing display, constructed with 4.78-in. microLED display modules.
91.2 - Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology (11:00 AM - 11:20 AM)
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Jungho Shin, Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Yoon-Hwan Moon, Ki-seok Jang, Jin-hyuk Oh, Ji-Eun Jung, Ga-Eun Lee, Yong-Sung Eom, Kwang-Seong Choi
Electronics and Telecommunications Research Institute Daejeon South Korea
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The authors report a demonstration of the SITRAB method to transfer, bond, and repair InGaN/GaN µLEDs. GaN-based LEDs assembled on the SITRAB interposer without serious misalignment and laser-assisted bonding with compression (LABC) result in robust interconnection between the µLEDs and the display backplane. The dead pixels of a µLED device with 32 × 32 resolution are completely repaired by transferring redundant LEDs onto the display substrates via the SITRAB process.
91.3 - Placement Accuracy of MicroLEDs in the 5µm Size Range Being Laser Mass Transferred (11:20 AM - 11:40 AM)
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Oliver Haupt, Thorge Griffel, Muhammad Fatahilah, Jan Brune
Coherent LaserSystems GmbH & Co. KG Goettingen Germany
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MicroLED displays require device placement accuracies that meet the dimensional restrictions of the contact pads. Accuracies achieved by a laser forward transfer (LIFT) system with dies in the 5µm size range over gap distances around 10-20 times the thickness of the devices will be discussed.
91.4 - Temperature Compensation Study of MicroLED by Machine Learning (11:40 AM - 12:00 PM)
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Yanjun Zhang
Shanghai Tianma Microelectronics Co., Ltd. Shanghai China
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Peixuan Chen, Yiting Liu
Tianma New Display Technology Research Institute (Xiamen) Co., Ltd. Xiamen China
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Bojia Lyu
Shanghai Tianma Microelectronics Co., Ltd. & Shanghai Jiao Tong University Shanghai China
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The performance of microLEDs is affected by temperature, leading to color shift. A machine-learning based approach for global compensation is proposed, which exhibits advantages including high compensation accuracy, good smoothness, and strong generalization performance. Experimental validation using measurements and simulated data is demonstrated.
91.5 Late-News Paper: The MicroAssembler: Deterministic Fluidic Assembly for Manufacturing MicroLED Displays (12:00 PM - 12:20 PM)
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Sourobh Raychaudhuri, Sergey Butylkov, Lara Crawford, Bradley Rupp, Patrick Maeda, Matt Gallelli, Eugene Chow, JengPing Lu
SRI International Palo Alto CA US
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The authors are developing a deterministic fluidic assembly process that uses software to sense, sort, and assemble micron-scale devices into desired patterns. This process can be adapted to assemble large numbers of microLEDs (uLEDs) over large areas with high throughput and nearly perfect yield. They present data demonstrating the precision and reliability of the process to illustrate its potential as a scalable process for manufacturing uLED displays.