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Session
84
: MicroLED Manufacturing |
Emissive, Micro-LED, and Quantum-Dot Displays
|
Friday, May 17 / 09:00 AM - 10:20 AM / San Jose Convention Center, 220C
Chair:
Zhaojun Liu, Southern University of Science and Technology, Shenzhen, China
84.1 - Invited Paper: Flexible Transparent MicroLED Array for Applications in Display and Visible Light Communication (9:00 AM - 9:20 AM)
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Runze Lin, Xinyi Shan, Daqi Shen, Xugao Cui, Pengfei Tian
Fudan University Shanghai China
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Planar integration of RGB InGaN-based microLEDs on flexible transparent material is realized using transfer printing technology. Based on on-off keying (OOK) modulation and wavelength division multiplexing (WDM), visible light communication rates of about 100 Mbps can be achieved, demonstrating the feasibility of this integrated device in full-color display applications.
84.2 - Invited Paper: High-Resolution Additive Manufacturing in the Fabrication of MicroLED Displays (9:20 AM - 9:40 AM)
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Filip Granek, Iwona Gr?dzka-Kurzaj, Jolanta Gadzali?ska, ?ukasz Witczak, Karolina Fi?czyk, Piotr Kowalczewski
XTPL S.A. Wroc?aw Poland
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Ultra-precise dispensing, a high-resolution additive manufacturing method, is used in the fabrication of microLED displays. The advancements in achieving ultra-small feature sizes, such as interconnections on complex topographies, edge printing, microvias filling, and microbumps dispensing, are described. The relevance of this technology for microLED display fabrication is discussed.
84.3 - Breakthrough for Test-Cost Reduction on MicroLED Device with High Parallel Single Insertion Testing of Electric-Luminescence Including External Quantum Efficiency and Electrical Test (9:40 AM - 10:00 AM)
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Kotaro Hasegawa, Koji Miyauchi
ADVANTEST CORPORATION Ora-gun,Gunma Japan
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Hiroshi Kaga
ADVANTEST CORPORATION Tokyo Japan
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The biggest challenge in launching microLED displays is cost reduction. In a previous report, the authors proposed a super cost-effective test method embedding EL and electrical testing (PEMPTM). In this paper, they report the validity of PEMPTM by comparing the external quantum efficiency (EQE) of LED emission and photodetection characteristics.
84.4 - Transfer of Flip-Chip Structure MicroLED from Sapphire to Thin Film (10:00 AM - 10:20 AM)
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Jiayi Li, Zhaojun Liu
Southern University of Science and Technology Shenzhen China
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Mass transfer is the key technology to realize the full color integration of microLED displays, which have a high yield requirement. In this work, laser is used to peel off the sapphire substrate, allowing an array of flip-chip structure microLED devices to be transferred onto the blue film. A UV film is then used for the secondary transfer of the micro-LED array, exposing the electrode structure and preparing the microLED array for subsequent bonding. The yield of the whole process can reach 99.7%.